******受招标人委托对下列产品及服务进行国际公开竞争性招标，于****-**-**公告。 本次招标采用传统招标方式，现邀请合格投标人参加投标。 *、招标条件 项目概况：多芯片射频集成电路系统级封装技术开发及产业化项目 资金到位或资金来源落实情况：国有资金，已落实 项目已具备招标条件的说明：招标条件已具备 *、招标内容： 招标项目编号：****-****IH****** 招标项目名称：多芯片射频集成电路系统级封装技术开发及产业化项目相关设备采购 项目实施地点：中国北京市 招标产品列表(主要设备)： 序号 产品名称 数量 简要技术规格 备注 * 多芯片射频集成电路系统级封装技术开发及产业化项目相关设备采购 * 套 复测良率：***%良品（****颗）复测各SITE良率差小于*% *、投标人资格要求 投标人应具备的资格或业绩：*）凡是来自中华人民共和国或是与中华人民共和国有正常贸易往来的国家或地区的法人或其他组织，具有同类设备制造、供货、安装能力的，均可参加投标； *）欢迎制造商直接投标，制造商也可以委托代理商参加投标。如果是代理商参加投标，代理商需提供设备制造商的授权，同时提供制造商相关的资格证明文件； *）与招标人存在利害关系可能影响招标公正性的法人或其他组织不得参加投标； *）接受委托参与项目前期咨询和招标文件编制的法人或其他组织不得参加受托项目的投标； *）单位负责人为同一人或者存在控股、管理关系的不同单位，不得参加同一招标项目投标； *）相关法律、法规规定的其他资格条件。 是否接受联合体投标：不接受 未领购招标文件是否可以参加投标：不可以 *、招标文件的获取 招标文件领购开始时间：****-**-** 招标文件领购结束时间：****-**-** 获取招标文件方式：现场领购 招标文件领购地点：*********室 招标文件售价：￥****/$*** 其他说明：具体时间：工作日上午**:**-**:**，下午**:**-**:**（北京时间） *、投标文件的递交 投标截止时间（开标时间）：****-**-** **:** 投标文件送达地点：*********室 开标地点：*********室 *、联系方式 招标人：****** 地址：北京市朝阳区燕东科技园内 联系人：姚永平先生 联系方式 ：+**-**-******** 招标代理机构：****** 地址：北京市东城区朝阳门北小街**号 联系人：代晓艳 女士、王萍萍 女士 联系方式 ：+**-**- *******，+**-**- ********，Email: ****** *、汇款方式 招标代理机构开户银行(人民币): 中国银行北京市分行 招标代理机构开户银行(美元): 中国银行北京市分行 账号(人民币): ************ 账号(美元): ************ 其他: *、受益人：****** *、SWIFT No.: BKCHCN BJ*** *、银行地址：北京市东城区朝阳门大街*号, 邮编：****** Beijing International Tendering Co.,Ltd. entrusted by the purchaser, invites sealed bids from eligible suppliers home and abroad for the supply of the following goods and/or service by way of International Competitive Bidding. The tender notice was released on ****-**-**. *.Bidding Conditions Overview：Muilt-Chip RF IC System-Level Assembly Technology Development and Industrialization Project Source of Funds：State fund, and have been raised. Description of The Prepared Bidding Conditions：Bidding conditions have been met. *.Bidding Content： Bidding No：****-****IH****** Project Name：Muilt-Chip RF IC System-Level Assembly Technology Development and Industrialization Project Procurement of Related Equipment Place of Implementation：Beijing, China List of Products： NO. Product Name Quantity Main Technical Data Remarks * Muilt-Chip RF IC System-Level Assembly Technology Development and Industrialization Project Procurement of Related Equipment * Set Re-test yield: ***% good units(*,*** units) re-test, each site yield difference *% *.Qualification Requirements For Bidder Qualifications or Performance：*.This Invitation for Bids is open to all legal persons or other organizations from within the People’s Republic of China (hereinafter abb. as “PRC”) and all countries/areas which have regular trade relations with PRC (hereinafter called “the eligible source countries/areas”) *. Manufacturers are welcome to participate in the bid directly, or entrust an agent. If the bidder is an agent, the manufacturer's authorization and related qualification documents should be provided. * Any legal person or other organization that has conflict of interest with the Tenderee and may have impact on fairness of the bidding is not allowed to participate in the bid. *.Any legal person or other organization that has been entrusted to provide consulting service at the preliminary stage of the project or to prepare the bidding document is not allowed to participate in the bid. *.Different bidders that have the same person in charge or have the relationship of share-holding or management should not participate in the bids for the same package. *. Other qualifications specified by the relevant laws and regulations. Joint Bids：NOT Available Bid without the bidding documents：NOT Available *.Acquisition of Bidding Documents Beginning of Selling Bidding Documents：****-**-** Ending of Selling Bidding Documents：****-**-** To Obtain：On-site Purchase Place：Room *** of Beijing International Tendering Co., Ltd. Price of Bidding Documents: ￥****/$*** Additional Instructions：Time for selling bidding documents: *:**-**:**am, **:**-**:**pm (Beijing Time) on working days. *.Bid Submission Deadline for Submitting Bids/Time of Bid Opening (Beijing Time)：****-**-** **:** Place of Bid：Room *** of Beijing International Tendering Co., Ltd. Place of Bid Opening：Room *** of Beijing International Tendering Co., Ltd. *.Contact Details Purchasers：Beijing Yan Dong Microelectronic Co., Ltd Add.：YanDong technology park, Chaoyang District, Beijing, P.R. China Contact：Mr Yao Tel：+**-**-******** Bidding Agency：Beijing International Tendering Co.,Ltd. Add.：No.** Beixiaojie (North Alley), Chaoyangmen, Dongcheng District, Beijing, P.R. China Contact：Ms Dai Xiaoyan, Ms Wang Pingping Tel ：+**-**- *******，+**-**- ********，Email: ****** *.Remittance Approach Bank(RMB):Bank of China, Beijing Branch Bank(USD):Bank of China, Beijing Branch Account NO.(RMB):************ Account NO.(USD):************ Additional:*. Beneficiary: Beijing International Tendering Co., Ltd. *. SWIFT No.: BKCHCN BJ***; *. Bank address: No. *,Chaoyangmennei St., Dongcheng District, Beijing, ******, P.R. China.